Rubicon Technology, Inc. (Nasdaq:RBCN) today announced the pricing of a
public offering of 3,950,000 shares of its common stock at a price of
$24.00 per share. All of the shares are being sold by the selling
stockholders identified in the prospectus. The underwriters have an
option to purchase up to an additional 592,500 shares of common stock
from the selling stockholders to cover over-allotments, if any.
UBS Investment Bank is serving as the sole book-running manager of the
offering. Canaccord Adams Inc., Needham & Company, LLC, William Blair &
Company, LLC and Janney Montgomery Scott LLC are acting as co-managers.
A copy of the final prospectus relating to the offering may be obtained
by contacting UBS Investment Bank, Prospectus Department, 229 Park
Avenue, New York, NY, 10171, telephone 1-888-827-7275.
A registration statement relating to the offering was filed with, and
was declared effective by, the Securities and Exchange Commission. This
offering is being made solely by means of a prospectus. This press
release does not constitute an offer to sell or the solicitation of an
offer to buy any of the Company's common stock, nor shall there be any
sale of the common stock in any jurisdiction in which such offer,
solicitation or sale would be unlawful prior to registration or
qualification under the securities laws of any such jurisdiction.
About RBCN: Rubicon Technology, Inc. is an advanced electronic materials
provider that is engaged in developing, manufacturing and selling
monocrystalline sapphire and other crystalline products for
light-emitting diodes (LEDs), radio frequency integrated circuits
(RFICs), blue laser diodes, optoelectronics and other optical
applications. The Company applies its proprietary crystal growth
technology to produce very high-quality sapphire in a form that allows
for volume production of various sizes and orientations of substrates
and windows. Rubicon is a vertically-integrated manufacturer with
capabilities in crystal growth, high precision core drilling, wafer
slicing, surface lapping, large-diameter polishing and wafer cleaning
processes, which the Company employs to convert the bulk crystal into
products with the quality and precision specified by its customers. The
Company is actively developing larger diameter products to support
next-generation LED, RFIC and optical window applications.
